SCHEDULE: NOV 15-20, 2015

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Verification of Resilient Communication Models for the Simulation of a Highly Adaptive Energy-Efficient Computer

SESSION: Regular & ACM Student Research Competition Poster Reception

EVENT TYPE: Posters, Receptions, ACM Student Research Competition

EVENT TAG(S): HPC Beginner Friendly, Regular Poster

TIME: 5:15PM - 7:00PM

SESSION CHAIR(S): Michela Becchi, Manish Parashar, Dorian C. Arnold

AUTHOR(S):Mario Bielert, Kim Feldhoff, Florina M. Ciorba, Stefan Pfennig, Elke Franz, Thomas Ilsche, Wolfgang E. Nagel

ROOM:Level 4 - Lobby

ABSTRACT:

Delivering high performance in an energy-efficient manner is of great importance in conducting research in computational sciences and in daily use of technology.
From a computing perspective, a novel concept (the HAEC Box) has been proposed that utilizes innovative ideas of optical and wireless chip-to-chip communication to allow a new level of runtime adaptivity for future computers, which is required to achieve high performance and energy efficiency.
HAEC-SIM is an integrated simulation environment designed for the study of the performance and energy costs of the HAEC Box running communication-intensive applications.
In this work, we conduct a verification of the implementation of three resilient communication models in HAEC-SIM.
The verification involves two NAS Parallel Benchmarks and their simulated execution on a 3D torus system with 16x16x16 nodes with Infiniband links.
The simulation results are consistent with those of an independent implementation.
Thus, the HAEC-SIM based simulations are accurate in this regard.

Chair/Author Details:

Michela Becchi, Manish Parashar, Dorian C. Arnold (Chair) - University of Missouri|Rutgers University|University of New Mexico|

Mario Bielert - Technical University of Dresden

Kim Feldhoff - Technical University of Dresden

Florina M. Ciorba - University of Basel

Stefan Pfennig - Technical University of Dresden

Elke Franz - Technical University of Dresden

Thomas Ilsche - Technical University of Dresden

Wolfgang E. Nagel - Technical University of Dresden

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